¹College of computer science, Neijiang Normal University, Neijiang, 641000, China
²The engineering & technical college of Chengdu University of Technology, Leshan, 614000, China
³Biomedicine Department of Electrical and Electronics Engineering, Faculty of Science and Technology, University of Macau, Macau SAR 999078, China

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Abstract—The intra-body communication is an emerging wireless communication technology. It gives rise to slight wound without any infection, makes relevant devices positioned more easily and plays an important role in realtime monitoring of human body. According to coupling modes of electrodes, the intra-body communication is classified into two types, the capacitive and the galvanic coupling intra-body communication. By analyzing relevant achievements available, it is concluded that the capacitive coupling communication is inappropriate for the medical implant intra-body communication because this communication mode requires the common grounding, while the galvanic coupling communication can exactly make up for the disadvantage of the former. In existing research overview, prototypes and experiments concerning the two coupling communication modes are thoroughly discussed, and research status of “surface-to-surface”, “surface-to-implant”, “implant-to-surface” and “implantto- implant” communication methods is emphasized as per installation positions of electrodes. Furthermore, opportunities and challenges of the communication technology are presented as well as its prospect. Although the galvanic coupling intra-body communication is confronted with many problems, it will be certain to be applied to the future implantable medical communication along with development of various related technologies and increasing demand for intelligent medical devices.

Index Terms—Intra-Body Communication, Capacitive Coupling, Galvanic Coupling, Implantable, Sensor

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Cite: Shuang Zhang, Yuping Qin, Jiangming Kuang, Peng Un Mak, Sio Hang Pun, Mang I Vai, Yihe Liu, "Development and Prospect of Implantable Intra- Body Communication Technology," Journal of Computers vol. 9, no. 2, pp. 463-474, 2014.